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ESD5B5.0ST1G Transient Voltage Suppressor
Bi-directional Micro-Packaged Diode for ESD Protection
The ESD5B Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time provide best in class protection on designs that are exposed to ESD. Because of its small size and bi-directional design, it is ideal for use in cellular phones, MP3 players, and portable applications that require audio line protection.
Specification Features http://onsemi.com
* * * * * * * * *
Small Body Outline Dimensions: nom 0.063 x 0.032 (1.6x0.8 mm) Low Body Height: nom 0.024 (0.6 mm) Reverse Working (Stand-off) Voltage: 5.0 V Peak Power up to 50 W @ 8 x 20 ms Pulse Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model IEC61000-4-2 Level 4 ESD Protection This is a Pb-Free Device
SOD-523 CASE 502 PLASTIC
MARKING DIAGRAM
B5 MG G B5 M G = Specific Device Code Date Code = Pb-Free Package
Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
(Note: Microdot may be in either location)
Device Meets MSL 1 Requirements
ORDERING INFORMATION MAXIMUM RATINGS
Rating IEC 61000-4-2 (ESD) ESD Voltage Contact Per Human Body Model Per Machine Model PPK PD TJ, Tstg TL Symbol Value 30 16 400 50 10 200 -55 to +150 260 Unit kV kV V W mW C C Device ESD5B5.0ST1G Package SOD-523 (Pb-Free) Shipping 3000/Tape & Reel
Peak Power (Figure 1) Per 8 x 20 ms Waveform Peak Power (Figure 2) Per 10 x 1000 ms Waveform Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 = 1.0 x 0.75 x 0.62 in.
(c) Semiconductor Components Industries, LLC, 2006
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November, 2006 - Rev. 1
Publication Order Number: ESD5B5.0ST1/D
ESD5B5.0ST1G
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT Parameter Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current IPP IT VC VBR VRWM IR IR VRWM VBR VC IT V IPP I
Bi-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
VRWM (V) Device* ESD5B5.0ST1G Max 5.0 IR (mA) @ VRWM Max 1.0 VBR (V) @ IT (Note 2) Min 5.8 Max 7.8 IT mA 1.0 C (pF) @ VR = 0 V, f = 1 MHz Typ 32
*Other voltages available upon request. 2. VBR is measured with a pulse test current IT at an ambient temperature of 25C. 100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0 0 20 40 t, TIME (ms) 60 80 0 1 2 3 4 tP tP tr PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP.
PEAK VALUE - IPP PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. I PP HALF VALUE - 2
tr 10 ms 100 VALUE (%)
PEAK VALUE - IPP I PP 2
HALF VALUE - 50
t, TIME (ms)
Figure 1. 8 x 20 ms Pulse Waveform
Figure 2. 10 x 1000 ms Pulse Waveform
Figure 3. Positive 8 kV Contact per IEC 6100-4-2 ESD5B5.0ST1G
Figure 4. Negative 8 kV Contact per IEC 6100-4-2 ESD5B5.0ST1G
http://onsemi.com
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ESD5B5.0ST1G
PACKAGE DIMENSIONS
SOD-523 CASE 502-01 ISSUE B
-X- A -Y- B 1 D 2 PL 0.08 (0.003)
M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D J K S MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067
2 TXY
C K J S -T-
SEATING PLANE
SOLDERING FOOTPRINT*
1.40 0.0547
0.40 0.0157
0.40 0.0157
SCALE 10:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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ESD5B5.0ST1/D

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